Molding Process and Equipment Engineer

Nexperia is a world-class company in semiconductor development and in-house production. We are looking for a Molding Process and Equipment Engineer to join our team.

Requirements

• Bachelor’s degree in any engineering discipline.
• Minimum 5 years of experience in the semiconductor industry, with at least 3 years specializing in EMC molding.
• Proven hands-on expertise in compression or transfer molding processes, including thin flat mold, exposed pad, and multi-die molding.
• Proficient in statistical analysis tools such as JMP and Minitab, and skilled in technical documentation.
• Deep understanding of mold compound properties, material flow dynamics, curing behavior, and interactions with other assembly materials.