The Senior Equipment Engineer (Molding) is responsible for leading the maintenance, optimization, and continuous improvement of molding equipment performance across diverse semiconductor package types.
Requirements
- Lead the maintenance and performance improvement of molding equipment across various package types.
- Monitor equipment downtime (DT) and implement mitigation plans through MTBF/MTBA analysis.
- Collaborate with cross-functional teams to maintain and update technical documentation such as control plans, process specifications, SOPs, technical reports, and FMEAs.
- Mentor and coach technicians to strengthen engineering competencies and drive continuous performance improvement.
- Diagnose and resolve molding-related equipment and process defects.
- Contribute to the development of process technology roadmaps for advanced packaging, thin form factors, and emerging device architectures.
- Drive improvement projects related to MVA, yield enhancement, and UPH optimization.
- Manage spare parts inventory and coordinate procurement activities to minimize downtime.
- Liaise with suppliers and vendors for jig and fixture orders, ensuring on-time delivery of parts and equipment.
- Maintain strong compliance with EHS standards and thrive in a fast-paced manufacturing environment.
Benefits
- Paid Time Off
- Retirement Plan