Cooling System Engineer

FII USA, Inc., a Foxconn Technology Group Company, is seeking a Cooling System Engineer to design, develop, and validate cooling solutions for enterprise-class server and storage platforms. The role involves collaborating with cross-functional teams to optimize thermal performance and ensure system reliability in high-performance computing environments. Candidates should be responsible for thermal analysis, simulation, testing, and compliance with industry standards.

Requirements

• Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Engineering, or related field
• 3–5 years of experience in thermal management, cooling system design, or related field
• Strong understanding of heat transfer, fluid dynamics, and thermodynamics
• Proficiency with CFD and thermal simulation tools
• Hands-on experience with thermal testing and measurement techniques
• Familiarity with server architectures, high-density electronics, and data center cooling requirements
• Strong analytical and problem-solving skills with attention to detail
• Effective communication and teamwork skills

Benefits

• Comprehensive benefits package including medical, dental, and vision insurance coverage.
• Basic life insurance and short-term disability coverage provided by employer.
• Supplemental life insurance and long-term disability coverage options available.
• 401K with employer contribution.
• Personal, Vacation, and Holiday paid time off
• Onsite Aurora Health & Wellness Center available for all employees.
• Employees are continuously encouraged to learn and grow their careers.