Intern - Summer 2026 – Packaging Engineer

Crestron Electronics is a leading provider of automation and control solutions. As a Summer 2026 Intern in Packaging Engineering, you will assist in designing and developing packaging solutions for new and existing products.

Requirements

• Currently pursuing a Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Industrial Design, or related field.
• Familiarity with CAD software (SolidWorks, AutoCAD, etc.) is preferred.
• Excellent analytical, problem-solving, and communication skills.
• Ability to work independently and collaboratively in a team environment.
• Detail-oriented with strong organizational skills.
• Strong interest in sustainable packaging and manufacturing processes.

Benefits

• Paid internship
• Dedicated mentor for development and acclimation to the company
• Training and networking opportunities
• Comprehensive experience that enhances technical and non-technical skill sets