Wafer Bonding Engineer

At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. We are looking for a Bonding Process Development Engineer for our Florida Advanced Packaging site.

Requirements

• Develop and temporary bonding and debonding capabilities for advanced packaging processes using spin-on polymers, laser debond films and tapes.
• Define and maintain automated and manual processes in tape application and temporary bond material deposition.
• Develop and maintain processes in permanent bonding using wafer to wafer techniques such as Hybrid Bonding/DBI.
• Coordinate with appropriate engineering areas to support integration of your processes for bonding and debonding.
• Investigate and drive integration changes for improved device performance and yield improvement.
• Work with process and tool engineers to find processing marginalities and make improvements.
• Routinely monitor selected in line and end of line SPC charts and defects for trends or excursions that can be addressed by integration changes.

Benefits

• 401k match
• Life insurance
• Opportunities to purchase SkyWater stock at a discounted rate
• Medical, dental, mental health benefits, vision, legal planning
• Short- and long-term disability
• Paid time off
• Paid holidays
• On-site fitness facility
• On-site self-serve market